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半导体 Semiconductor Solutions
提供卓越精度和佳性能的精密解决方案 -
Precision Solutions for Superior Accuracy and Optimal Performance
晶圆制造Wafer Fabrication
精度是半导体制造中的一切，因为即使小的变化也会对功能产生重大影响。世界上先进的微处理器是在使用Deublin的机器上制造的。
Precision is everything in semiconductor manufacturing, because even the smallest variations can have a big impact on functionality. The world's most sophisticated microprocessors are made on machines that use Deublin.
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Ingot Production
铸锭生产
半导体从加热到1420°C的熔融硅坩埚开始。Deublin接头冷却拉杆，拉杆的旋转方向与坩埚的旋转方向相反。拉杆末端的晶种从熔体中缓慢提起，随着时间的流逝，铸锭直径可达300毫米，长2米。Semiconductors begin in a crucible of molten silicon, heated 1420°C. A Deublin union cools the puller rod, which rotates in the opposite direction from the crucible. A seed crystal at the end of the puller rod lifts slowly from the melt, resulting over time in an ingot up to 300mm in diameter by 2 meters long.
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Slicing
切片
圆柱形或矩形的铸锭通过金刚石涂层的线锯切成均匀的薄片。Deublin联轴节冷却导轮，以保持切割顺畅和笔直。The cylindrical or rectangular ingot is sliced into uniform wafers by a diamond-coated wire saw. Deublin unions cool the guide rollers that keep the cut smooth and straight.
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Grinding
打磨
切片后，将晶片研磨以去除锯痕和表面缺陷，并使晶片达到终厚度。Deublin空气联结器可确保在加工过程中均匀地清除毛坯，而Deublin水联结器可保持磨削表面凉爽。After slicing, the wafer is ground to remove saw marks and surface defects, and to bring the wafer to final thickness. Deublin air unions ensure uniform stock removal during the process, and Deublin water unions keep the grinding surface cool.
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Polishing
抛光
终抛光去除了晶片表面上任何残留的微观缺陷，并在将要制成芯片的一侧进行了镜面抛光。Deublin活接头控制抛光过程的压力和温度。Final polishing removes any remaining microscopic defects in the wafer surface, and imparts a mirror finish on the side that will be made into chips. Deublin unions control the pressure and temperature of the polishing process.
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Circuitry Creation电子芯片制造
从手中的手机到家中的可编程恒温器，世界取决于芯片。这些芯片的制造商取决于Deublin的质量和可靠性。
From the mobile phone in your hand to the programmable thermostat in your home, the world depends on chips. The makers of those chips depend on Deublin quality and reliability.
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ECD
电化学沉积
电化学沉积是将化学流体中的金属原子沉积在晶片表面上的过程。Deublin接头将晶片固定在适当的位置，而Deublin滑环传输成功沉积所需的电流和电压。Electro-Chemical Deposition is a process by which metal atoms from a chemical fluid are deposited on the wafer surface. Deublin unions hold the wafer in position, and Deublin slip rings transmit the current and voltage necessary for successful deposition.
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ALD
原子层沉积
原子层沉积使Deublin的客户能够制造导电或绝缘材料的薄膜，并在纳米级结构中实现均匀覆盖。Atomic Layer Deposition enables Deublin customers to fabricate thin films of either conducting or insulating material with uniform coverage in nanometer-sized structures. |
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CVD
化学气相沉积
化学气相沉积法将纳米厚度的电介质和金属材料膜沉积在晶片上。此过程在极高的温度（800-2000°C）下发生，需要Deublin联轴器冷却设备并保持过程稳定性。
Chemical Vapor Deposition places nanometer-thick films of dielectric and metalmaterials on a wafer. This process occurs at extremely high temperatures (800.2000°C), requiring Deublin unions to cool the equipment and to maintainprocess stability. |
Ion Implant
离子注入
在芯片制造期间多次使用离子注入来形成晶体管。在离子注入过程中，晶片被称为掺杂剂的带电离子束轰击，该离子改变了裸露表面的电性能。lon implantation is used many times during chip fabrication to form transistors.During ion implantation, wafers are bombarded by a beam of electricallycharged ions, called dopants, that change the electrical properties of theexposed surface.
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CMP
化学机械抛光
化学机械平面化可产生均匀平坦的晶圆表面，以准备沉积额外的材料层，这些材料终成为终微处理器，存储芯片，LED和其他产品的电路。Chemical Vapor Deposition places nanometer-thick films of dielectric and metal materials on a wafer. This process occurs at extremely high temperatures (800-2000°C), requiring Deublin unions to cool the equipment and to maintain process stability. |
Process Control
过程控制
Deublin接头在精细校准的晶圆制造设备中产生热稳定性。Deublin电子滑环为设备内置的计量系统供电并从中返回数据。Deublin unions create thermal stability in finely calibrated wafer fabrication equipment. Deublin electrical slip rings provide power to and return data from metrology systems built in to the equipment. |
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卷对卷 R2R
卷对卷处理将金属薄层沉积到柔性基板上，以制造太阳能电池板，薄膜电池和柔性电子产品。旋转接头调节温度并消散高温沉积过程中的热量。Roll-to-Roll processing deposits thin layers of metal onto flexible substrates to create solar panels, thin-film batteries and flexible electronics. Rotary unions regulate temperature and dissipate heat from the high-temperature deposition process. |
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1-Channel
单通道
这些紧凑型旋转接头设计用于失速调节的风力涡轮机，风力涡轮机通常具有1 MW或更小的功率输出。These compact rotary unions are designed for stall-regulated wind turbines, which most often have a power output of 1 MW or less. |
2-Channel
双通道
变桨调节型风力涡轮机要求在数百万次循环中保持可靠性。Deublin旋转接头具有耐用性，可显着减少陆上和海上作业的停机时间和维护成本。Pitch-regulated wind turbines demand reliability over millions of cycles. Deublin rotary unions include durability features that significantly reduce downtime and maintenance costs for both on- and off-shore operations.
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3-Channel
三通道
所有Deublin风力发电机组均已在运行压力下进行了100％出厂测试，以确保每个风力发电机组在收到并准备安装后即可完全正常运行。All Deublin wind unions are 100% factory tested under operating pressures to ensure that each union is completely operational upon receipt and ready to install. |
4-Channel
四通道
用于风能的Deublin旋转接头采用了专有的受控泄漏密封技术。Deublin rotary unions for wind energy employ a proprietary, controlled leakage sealing technology.
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信德迈科技(北京)有限公司专业提供美国杜博林Deublin多通道旋转接头、导电滑环应用于半导体工业和化学机械抛光机CMP。 化学机械抛光机CMP 技术和设备产品配套旋转接头。可广泛应用于IC制造、TSV/3D封装、MEMS、晶圆、基片等制造领域。
- 规格参数：6通道旋转接头，介质：空气和去离子水。欢迎咨询、联系和采购 010-8428 2935,13910962635。
Deublin rotary union Semiconductor industry: Physical Vapor Deposition (PVD), wafer processing or Chemical Mechanical Planarization (CMP) operations.
- 可广泛应用于IC制造、TSV/3D封装、MEMS、晶圆、基片等制造领域。化学机械抛光机CMP 技术和设备产品配套旋转接头。
- 规格参数：6和8通道旋转接头、导电滑环组合接头。
- 介质：空气和去离子水
- 物理气象沉积 PVD应用旋转接头
规格参数：16通道冷却旋转接头
- 芯片处理旋转接头
规格参数：机械密封+软密封
650RPM，间歇运行
空气，真空和硅浆
不锈钢壳体
无内部泄露
- 第一、二、三代半导体的区别在哪里？
- 半导体薄膜沉积工艺
- 刻蚀、薄膜沉积和离子注入工艺
- 在集成电路制造产业链中，CMP设备在硅片制造、集成电路制造、封装测试三大环节均有应用，其中集成电路制造是CMP设备应用最主要的场景
- ECD Electrical Chemical Deposition 电化学沉积技术在集成电路行业的应用
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